PREPARATION OF SOFT SOLDER JOINTS

The preparation of solder joints in electronic applications is not eas y because the solder is soft and often surrounded by hard and brittle materials. Smearing, scratching, and structural changes caused by the preparation as well as destruction of the specimens during preparation due to their filigree geometries make the procedure demanding. A sequ ence has been developed that enables the preparation of soft solder un der these difficult circumstances. The preparation and the development of the phases found in solder is explained step by step and illustrat ed with examples. (C) Elsevier Science Inc., 1996.