Testing electronic products is a crucial part of the manufacturing pro
cess. This is particularly the case with today's complex products, in
which even the smallest hardware defect can cause serious malfunctions
. Integrated circuits being their Life on a wafer and are tested even
before the wafer is diced into chips. The chips are subsequently packa
ged and used in higher level electronics. Each manufacturing step can
introduce new defects. However, as products become more complex, it be
comes more difficult to use traditional external testing methods. This
is the case because the integrated-circuit chips that that these prod
ucts contain have an increasing number of deeply embedded core functio
ns and are also operating at increasing frequencies. In addition, test
ing equipment has bandwidth and performance limitations. In many cases
, BIST, which moves critical test and measurement functions inside chi
ps, can be used to conduct the necessary testing. BIST, which utilizes
scanning technology, provides the stimulus-generation and response-pr
ocessing capabilities necessary to test complex logic structures and e
mbedded memory. Embedded BIST functions match the chip's capabilities,
which can make them very effective testing mechanisms. Also, BIST sta
ys with the chip throughout its life. Moreover, the addition of BIST f
eatures to electronics hardware frequently doesn't significantly incre
ase a product's size, cost, and production time, as was the case in th
e past.