A 10 GB S HYBRID-INTEGRATED RECEIVER ARRAY MODULE USING A PLANAR LIGHTWAVE CIRCUIT (PLC) PLATFORM INCLUDING A NOVEL ASSEMBLY REGION STRUCTURE/

A planar lightwave circuit (PLC) platform for optoelectronic hybrid in tegration shows potential for achieving 10 Gb/s operation, It uses AuS n bump-type bonding pads on a silica layer to decrease parasitic capac itance, which limited the CR time constant in the optical chip assembl y region, and two-layer electrical wiring to reduce parasitic inductan ce, which caused resonance in the electrical circuit region, An arraye d receiver module fabricated by integrating a two-channel monolithic o pto-electronic integrated circuit (OEIC) chip on the PLC platform demo nstrated a 3 dB-bandwidth of 8 GHz in both channels, which is equal to the bandwidth of the OEIC chip. This shows the feasibility of using t his PLC platform for multichannel 10 Gb/s operation, Furthermore, this PLC platform can combine the versatile optical circuit functions of a PLC, such as an arrayed-waveguide grating wavelength multiplexer, wit h the high-speed signal processing function of mature electronic IC ci rcuits, Consequently, this platform is a key device that will lead to high-capacity optical signal processing systems using optical waveleng th/frequency routing.