DIRECT WRITING OF GOLD AND COPPER LILIES FROM SOLUTIONS

For printed circuit repair and fine pitch wiring a metallization techn ique is investigated which could be applied in ambient air. Organo-met allic precursors containing gold or copper are dissolved in a variety of solvents and spilled onto the substrate, Dimethylenglykoldimethylet her, DME, exhibits best properties with respect to a high solubility o f the precursor and slow evaporation of the solvent. With second harmo nic Nd:YAG or argon ion laser radiation of 150 mW power metal lines ar e written on polyimide from organo-gold(I) and copper compounds with a writing speed of 0.6 mm/s. First results of writing on SiC substrates with Nd:YAG laser radiation of 3 W power from PEt(3)AuCl are reported . Micrographs and measurements of the resistivity of the laser written Lines are given.