AN INTERFACIAL DELAMINATION ANALYSIS FOR MULTICHIP-MODULE THIN-FILM INTERCONNECTS

Analysis of interfacial delamination for multichip module thin-film in terconnects (MCM/TFI) is the primary objective of this paper. An inter face crack model is integrated with finite-element analysis to allow f or accurate numerical evaluation of the magnitude and phase angle of t he complex stress intensity factor. Under the assumption of quasi-stat ic delamination growth, the fate of an interfacial delamination after inception of propagation is determined. It is established that whether an interfacial delamination will continue to grow or become arrested depends on the functional behavior of the energy release rate and load ing phase angle over the history of delamination growth. This function al behavior is numerically obtained for a typical MCM/TFI structure wi th delamination along die and via base, subjected to thermal loading c ondition. The effect of delamination interactions on the structural re liability is also investigated It is observed that the delamination al ong via wall and polymer thin film can provide a benevolent mechanism to relieve thermal constraints, leading to via stress relaxation.