BALL GRID ARRAY THERMOMECHANICAL RESPONSE DURING REFLOW ASSEMBLY

The thermomechanical response of ball-grid array assemblies during ref low soldering is considered here. Experiments are performed to investi gate the thermomechanical response of a representative system and the results are used to validate a numerical model of system behavior. The conclusions drawn from the experimental studies are used to guide dev elopment of a process model, capable of describing more realistic BGA soldering scenarios. Process model predictions illustrate the system's thermomechanical response to thermal and mechanical processing condit ions, as well as component properties. High thermal conductivity assem blies show the greatest sensitivity to mechanical loading conditions.