DEVELOPMENT OF AN INTEGRATED DESIGN SYSTEM FOR THERMAL RELIABILITY PREDICTION OF SMT SOLDER INTERCONNECTS

Authors
PAO YH JIH E SIDDAPUREDDY V
Citation
Yh. Pao et al., DEVELOPMENT OF AN INTEGRATED DESIGN SYSTEM FOR THERMAL RELIABILITY PREDICTION OF SMT SOLDER INTERCONNECTS, Journal of electronic packaging, 118(4), 1996, pp. 235-243
Citations number
12
Categorie Soggetti
Engineering, Mechanical","Engineering, Eletrical & Electronic
Journal title
Journal of electronic packaging → ACNP
ISSN journal
10437398
Volume
118
Issue
4
Year of publication
1996
Pages
235 - 243
Database
ISI
SICI code
1043-7398(1996)118:4<235:DOAIDS>2.0.ZU;2-A