A micromachining process, using ion track etching in combination with
lithographic patterning, is presented. The technique employs a substra
te pre-irradiated with swift heavy ions and uses a conventional Lithog
raphic technique to control the access of a track-selective etching me
dium to the ion tracks. Experimental results show the possibility of g
enerating high aspect ratio structures in virtually any direction in s
ingle crystalline quartz, which otherwise exhibits a strong ''natural'
' anisotropy to conventional wet etching. In this way complex, three-d
imensional quartz structures of 80 mu m height with vertical or pre-de
fined inclination angles of the walls were produced. The process can b
e applied to other, even highly radiation resistant, dielectric materi
als such as mica and organic polymers. (C) 1996 American Institute of
Physics.