Mb. Kleiner et al., PERFORMANCE IMPROVEMENT OF THE MEMORY-HIERARCHY OF RISC-SYSTEMS BY APPLICATION OF 3-D TECHNOLOGY, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(4), 1996, pp. 709-718
In this paper, the performance of the memory hierarchy of RISC-systems
for implementations employing three-dimensional (3-D) technology is i
nvestigated, Relating to RISC-systems, 3-D technology enables the inte
gration of multiple chip-layers of memory together with the processor
in one 3-D IC, In a first step, the second-level cache can be realized
in one 3-D IC with professor and first-level cache, This results in a
considerable reduction of the hit time of the second-level cache due
to a decreased access time and a larger allowable bus-width to the sec
ond-level cache, In a further step, the main memory can be integrated
which relieves restrictions with respect to the bus-width to main memo
ry, The use of 3-D technology for system implementation is observed to
have a significant impact on the optimum design and performance of th
e memory hierarchy, Based on an analytical model, performance improvem
ents on the order of 20% to 25% in terms of the average time per instr
uction are evaluated for implementations employing 3-D technology over
conventional ones. It is concluded that 3-D technology is very attrac
tive for future RISC-system generations.