PERFORMANCE IMPROVEMENT OF THE MEMORY-HIERARCHY OF RISC-SYSTEMS BY APPLICATION OF 3-D TECHNOLOGY

Citation
Mb. Kleiner et al., PERFORMANCE IMPROVEMENT OF THE MEMORY-HIERARCHY OF RISC-SYSTEMS BY APPLICATION OF 3-D TECHNOLOGY, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(4), 1996, pp. 709-718
Citations number
29
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
ISSN journal
10709894
Volume
19
Issue
4
Year of publication
1996
Pages
709 - 718
Database
ISI
SICI code
1070-9894(1996)19:4<709:PIOTMO>2.0.ZU;2-R
Abstract
In this paper, the performance of the memory hierarchy of RISC-systems for implementations employing three-dimensional (3-D) technology is i nvestigated, Relating to RISC-systems, 3-D technology enables the inte gration of multiple chip-layers of memory together with the processor in one 3-D IC, In a first step, the second-level cache can be realized in one 3-D IC with professor and first-level cache, This results in a considerable reduction of the hit time of the second-level cache due to a decreased access time and a larger allowable bus-width to the sec ond-level cache, In a further step, the main memory can be integrated which relieves restrictions with respect to the bus-width to main memo ry, The use of 3-D technology for system implementation is observed to have a significant impact on the optimum design and performance of th e memory hierarchy, Based on an analytical model, performance improvem ents on the order of 20% to 25% in terms of the average time per instr uction are evaluated for implementations employing 3-D technology over conventional ones. It is concluded that 3-D technology is very attrac tive for future RISC-system generations.