Silicon carbide amorphous thin films have been bombarded with 100 keV
N ions. Infrared-absorption spectroscopy has been used to study the ef
fect of increasing ion doses, up to 5 X 10(17) N+ cm(-2), on the evolu
tion of chemical bonding between Si, C, and N. The changes induced by
thermal annealing at different temperatures, up to 973 K, on the stabi
lity of the bombardment induced SiCxNy phase are investigated, togethe
r with the effect of surface oxidation during the postannealing coolin
g of the films. The new phase is thermally stable within the temperatu
re range investigated. At the highest implantation dose a threshold is
reached above which N atoms are located as interstitial, or are weakl
y bonded in the host film. Annealing at high enough temperature induce
s migration toward the surface and subsequent loss of interstitial N.
(C) 1997 American Institute of Physics.