R. Swope et Ws. Yoo, CARBON CONTAMINATION LEVELS IN PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITED FLUORINATED SILICA GLASSES, JPN J A P 1, 35(11), 1996, pp. 5843-5844
In this study, the carbon levels in fluorinated silica glass (FSG) fil
ms were investigated. FSG films were deposited using a dual-frequency
sequential-deposition plasma-enhanced chemical vapor deposition (PECVD
) reactor using TEOS, O-2 and C2F6 as source reagents. It was found th
at FSG films have substantially lower carbon levels than undoped PECVD
TEOS-based silicon dioxide films. Carbon content was also found to be
dependent on the fluorine content in the films.