Vast quantities of deionized water are required for semiconductor manu
facturing. Cost savings and regional water limitations motivate reduct
ion, recycling, and reclamation. Substantial reductions can be achieve
d by simply eliminating excessive water flow through existing baths. A
fully optimized fab DI system can only be realized through a thorough
understanding of rinsing mechanisms and hardware design. Optimized ba
ths allow for thorough cleaning of wafer surfaces with reduced total w
ater. Recycling and reclamation generally require substantial upgrades
to drain systems.