The compound semiconductor industry is poised for rapid market advance
s during the next several years and this is creating a need for develo
pment of economical and high yield production equipment. These develop
ment efforts increasingly rely on advanced modelling with experimental
verification. We report here on the utilization of modeling to rapidl
y develop a large scale production Rotating Disk Reactor (RDR). The in
fluence of the equipment design and deposition process parameters on f
low and temperature uniformity and on process characteristics are anal
yzed in this payer. Three dimensional Navier-Stokes flow modelling has
been used to study the effect of an asymmetric exhaust at the base of
the reactor on the uniformity of the rotating disk boundary layer in
a scaled RDR. Results show that the asymmetric exhaust port does not d
isrupt the symmetry of the flow above the rotating disk for typical op
erating conditions, and for hydrogen flow the convective heat transfer
from the disk is quite uniform (2% variation) over most (80%) of the
surface. Thermal modelling of the RDR, which includes heat transfer by
radiation, convection and conductance, was used to improve the temper
ature uniformity. Use of the recently developed Rotating Wafer Thermal
Mapping (RWTM) technique verified the temperature distribution across
the wafer under operational conditions, with measured uniformities of
1.3 degrees C and 2.5 degrees C for 2'' and 4'' wafers, respectively.
In-situ thermocouples were used to control substrate heating. The sub
strate temperature uniformity was found to depend strongly upon the pr
ocess temperature, process pressure, gas composition, gas flow, and wa
fer carrier rotation speed. This in turn affects the properties of the
sown Films. This new reactor has been used to produce multiple 4'' Ga
As/AlAs Bragg reflectors with < 1.0% variation in peak reflectivity wa
velength, 4'' GaAs Si doped epilayers with < 2.0% doping uniformity, a
nd to simultaneously demonstrate multiple 2'' InGaP films with better
than +/- 0.75 nm photoluminescence wavelength uniformity.