LARGE-AREA, PRODUCTION MOCVD ROTATING-DISK REACTOR DEVELOPMENT AND CHARACTERISTICS

Citation
Gs. Tompa et al., LARGE-AREA, PRODUCTION MOCVD ROTATING-DISK REACTOR DEVELOPMENT AND CHARACTERISTICS, Microelectronics, 25(8), 1994, pp. 757-765
Citations number
12
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
ISSN journal
00262692
Volume
25
Issue
8
Year of publication
1994
Pages
757 - 765
Database
ISI
SICI code
0026-2692(1994)25:8<757:LPMRRD>2.0.ZU;2-C
Abstract
The compound semiconductor industry is poised for rapid market advance s during the next several years and this is creating a need for develo pment of economical and high yield production equipment. These develop ment efforts increasingly rely on advanced modelling with experimental verification. We report here on the utilization of modeling to rapidl y develop a large scale production Rotating Disk Reactor (RDR). The in fluence of the equipment design and deposition process parameters on f low and temperature uniformity and on process characteristics are anal yzed in this payer. Three dimensional Navier-Stokes flow modelling has been used to study the effect of an asymmetric exhaust at the base of the reactor on the uniformity of the rotating disk boundary layer in a scaled RDR. Results show that the asymmetric exhaust port does not d isrupt the symmetry of the flow above the rotating disk for typical op erating conditions, and for hydrogen flow the convective heat transfer from the disk is quite uniform (2% variation) over most (80%) of the surface. Thermal modelling of the RDR, which includes heat transfer by radiation, convection and conductance, was used to improve the temper ature uniformity. Use of the recently developed Rotating Wafer Thermal Mapping (RWTM) technique verified the temperature distribution across the wafer under operational conditions, with measured uniformities of 1.3 degrees C and 2.5 degrees C for 2'' and 4'' wafers, respectively. In-situ thermocouples were used to control substrate heating. The sub strate temperature uniformity was found to depend strongly upon the pr ocess temperature, process pressure, gas composition, gas flow, and wa fer carrier rotation speed. This in turn affects the properties of the sown Films. This new reactor has been used to produce multiple 4'' Ga As/AlAs Bragg reflectors with < 1.0% variation in peak reflectivity wa velength, 4'' GaAs Si doped epilayers with < 2.0% doping uniformity, a nd to simultaneously demonstrate multiple 2'' InGaP films with better than +/- 0.75 nm photoluminescence wavelength uniformity.