EFFECT OF THERMAL CYCLING ON STRESSES IN THIN SILICON-NITRIDE AND SILICON-CARBIDE FILMS

Authors
LIM CW TOH CC FU JK LAHIRI SK
Citation
Cw. Lim et al., EFFECT OF THERMAL CYCLING ON STRESSES IN THIN SILICON-NITRIDE AND SILICON-CARBIDE FILMS, Journal of materials science letters, 15(24), 1996, pp. 2177-2179
Citations number
10
Categorie Soggetti
Material Science
Journal title
Journal of materials science letters → ACNP
ISSN journal
02618028
Volume
15
Issue
24
Year of publication
1996
Pages
2177 - 2179
Database
ISI
SICI code
0261-8028(1996)15:24<2177:EOTCOS>2.0.ZU;2-9