The dissolution of ferronickel (50 wt% Fe + 50 wt% Ni) in a thin (50-1
00 mu m) layer of Pd-Si melt at 1000 degrees C is studied, The concent
ratio n of elements constituting the backing in the melt increases wit
h the time of heat treatment (5 to 45 min) and with the increase of si
licon content of the initial Pd-Si composition (1.5 to 4.8 wt% Si). Th
is agnes with the data on the dissolution of pure nickel in a Pd-Si me
lt [1]. Ferronickel dissolves mon actively than nickel owing to the pr
esence of iron increasing the activity of silicon in the melt. During
solidification on cooling nickel remains essentially in the melt, wher
eas iron alloys the solid solution. It is concluded that the partition
of backing components between the solid and liquid phases is strongly
affected by the strength of bonds between the components of the melt.