INITIATION OF POLYMERIZATION WITH SUBSTITUTED ETHANES .13. FREE-RADICAL POLYMERIZATION OF METHYL-METHACRYLATE AND STYRENE WITH SUBSTITUTED SUCCINONITRILES
D. Braun et al., INITIATION OF POLYMERIZATION WITH SUBSTITUTED ETHANES .13. FREE-RADICAL POLYMERIZATION OF METHYL-METHACRYLATE AND STYRENE WITH SUBSTITUTED SUCCINONITRILES, Macromolecular chemistry and physics, 196(2), 1995, pp. 573-591
Tetraarylsuccinonitriles 2 were synthesized via oxidative dimerization
of diarylacetonitriles 1 in basic media. The thermal decomposition of
2 results in two identical diarylcyanomethyl semiradicals 3. The diss
ociation energy (E(a)) measured using the thiophenol radical scavengin
g technique was found to amount to 94,3 +/- 9,2 kJ/mol in the case of
tetraphenylsuccinonitrile 2a. Tetraarylsuccinonitriles 2 show an atypi
cal ''stepwise'' initiation mechanism in free-radical polymerization,
particularly in the case of methyl methacrylate (MMA) as monomer. In t
he initial phase of the polymerization reaction a very high concentrat
ion of diarylcyanomethyl primary radicals 3 leads to the formation of
short-chain telechelics with both end groups originating from the init
iator. In the further course of the polymerization these MMA telecheli
cs are able to re-form radicals by the scission of thermolabile carbon
-carbon bonds and by the release of initiator end groups, and so the M
MA telechelics 're-initiate' the free-radical polymerization (''resusc
itable free-radical polymerization''). In styrene polymerization, tetr
aarylsuccinonitriles 2 indeed cause a pronounced primary radical termi
nation effect, but the styrene telechelics formed in contrast to MMA t
elechelics are thermostable, and therefore no ''re-initiation'' effect
occurs. The X-ray structure determination of the styrene telechelic 2
,2,3,5,5-pentaphenyladiponitrile 4a exhibits a bond length of the ther
molabile carbon-carbon bond of 158,7 pm as compared to 162,8 pm of the
corresponding MMA telechelic tetraphenyl-3-methoxycarbonyl-3-methylad
iponitrile and emphasizes the higher thermal stability of 4.