ON TEMPERATURE PREDICTION OF MULTIPLE-CHIP PACKAGES BY A COMBINED ANALYSIS-FINITE ELEMENT METHOD

Numerical calculations based on a hybrid method, which consists of ana lytic and finite-element method, have been carried out to study temper ature distributions of multi-chip packages. Unlike finite element meth od, this method is able to discretize the distributed sources with dis continuities into coarse elements, and the solution is still accuratel y calculated. The effect of Reynolds number and channel wall-to-wall s pacing were investigated. The results obtained from the numerical stud y have been compared with the previous experimental data, and found to be favorable.