We have evaluated poly-(acrylic acid) (PAA) and poly-(alpha-methyl-sty
rene) (PMST) as overcoats used to stabilize the lithographic performan
ce of chemically amplified resist during the delay (FED) between expos
ure and post-exposure baking. We used water. aniline and NMP as model
compounds of airborne contaminants. Both films are shown to improve th
e stability of resist performance during FED. PMST is more effective i
n preventing atmospheric water penetration than PAA, as evidenced by t
he finding that che sensitivity of PAA-coated resist is dependent on t
he relative humidity of ambient air. Conversely, the PAA-coated resist
is more stable against high vapor concentration of aniline and NMP, w
hen exposed for several hours. This is probably because the negative c
harge of the carboxyl groups in PAA electrically traps aniline and NMP
, preventing their penetration to the resist films.