THERMAL CONTACT CONDUCTANCE OF CERAMIC SUBSTRATE JUNCTIONS

Authors
CHUNG KC BENSON HK SHEFFIELD JW
Citation
Kc. Chung et al., THERMAL CONTACT CONDUCTANCE OF CERAMIC SUBSTRATE JUNCTIONS, Journal of heat transfer, 117(2), 1995, pp. 508-510
Citations number
6
Categorie Soggetti
Engineering, Mechanical",Thermodynamics
Journal title
Journal of heat transfer → ACNP
ISSN journal
00221481
Volume
117
Issue
2
Year of publication
1995
Pages
508 - 510
Database
ISI
SICI code
0022-1481(1995)117:2<508:TCCOCS>2.0.ZU;2-G