A never and simple method is proposed to produce high-performance nitr
ided oxides. Thin oxides nitrided only in NH3 at 900 degrees C for 1 h
at 0.1 Torr have excellent interface stability, few electron traps, a
nd excellent reliability. Although the nitrogen concentration [N] at t
he dielectric/Si substrate interface is kept at a low value, the hydro
gen concentration [H] has been shown to be comparable to that of pure
oxide at the beginning of the nitridation. Consequently, a high ratio
of [N]/[K], which reflects the stable interface, can be attained at th
e initial stage of the very-low-pressure nitridation (VLPN). This is v
ery different from the case of conventional low-pressure nitridation.
The retarded formations of the interfacial Si3N4 and the surface nitro
gen-rich oxynitrides are conjectured to be the main cause of reduction
in the hydrogen content in the dielectrics during VLPN. Due to the si
mplicity and wide process window, VLPN is promising for the future ult
ra-large-scale-integration (ULSI) technology.