N. Hatzopoulos et al., OPTICAL INVESTIGATION OF STRUCTURES FORMED BY 2 MEV OXYGEN IMPLANTATION INTO SILICON, Thin solid films, 289(1-2), 1996, pp. 90-94
Silicon was implanted with 2 MeV O+ ions with doses covering the range
from 2 x 10(17) cm(-2) to 1 x 10(18) cm(-2) at an implantation temper
ature of not less than 600 degrees C. Subsequently, samples were annea
led at 1300 degrees C for 6 h. Fourier transform infrared reflection s
pectroscopy has been used in order to characterise the as-implanted an
d annealed samples. The interference fringes observed in the transpare
nt region (1500 cm(-1) to 7000 cm(-1)), are very sensitive to changes
in the structure of the examined sample. Cross-correlation with H+ bea
m Rutherford backscattering spectroscopy (RES)/channelling results, gi
ves a good agreement within the depth resolution (100 nm) of the RES t
echnique. No anomalous diffusion was observed during annealing and a b
uried layer formed during annealing even for the lowest dose, IR spect
roscopy constitutes the most suitable non-destructive method to invest
igate structures formed by MeV implantation.