CURING BEHAVIOR OF WOOD ADHESIVES UNDER HIGH-PRESSURE STEAM .2.
Citation
K. Umemura et al., CURING BEHAVIOR OF WOOD ADHESIVES UNDER HIGH-PRESSURE STEAM .2., Mokuzai Gakkaishi, 42(1), 1996, pp. 65-73
Categorie Soggetti
Materials Science, Paper & Wood
SICI code
0021-4795(1996)42:1<65:CBOWAU>2.0.ZU;2-V
Abstract
The curing behavior of urea formaldehyde (UF) resin under steam-inject
ion heating was studied using a fourier transform infrared spectromete
r (FT-IR) and a solvent extraction test. In addition, hot-platen curin
g and steam-injection curing of the resin were compared with each othe
r. The results were as follows: (1) In the reaction of 1,3-dimethylolu
rea as a model compound under steam-injection heating, the formations
of linear or cyclic tertiary amide and cyclic ether were observed. The
se were slightly observed in hot-platen heating. (2) In the reaction o
f UF resin under steam injection heating, marked chemical changes took
place, which were not observed in the hot-platen heating. Furthermore
, the cyclic ether formed by the curing reaction was considered to be
relatively stable even under steam-injection heating. (3) Compared wit
h hot-platen heating, UF resin react more quickly and increase warm wa
ter insoluble matter in steam-injection heating. Afterwards, however,
it was shown that the reaction of UF resin apparently came to equilibr
ium at lower temperature of 120 degrees C, and the hydrolysis proceede
d at higher temperature of 160 degrees C.