RESIN CURE MONITORING-SYSTEM BASED ON NONDESTRUCTIVE DIELECTRIC SPECTROMETRY

An on-line indirect cure monitoring prototype system is described base d on dielectric spectrometric measurements (frequency dependences of t he dielectric modulus and/or dielectric permittivity and/or dielectric loss factor and/or relaxation spectrum). A key block of the system is the Dielectric Spectrometer, Model DS 7056-C interfaced with a standa rd PC. A variation of the dielectric frequency spectra during the cure process for two epoxy systems based on araldite resins LY556 and LY56 1-1 are considered as an illustration of capabilities of the described hardware and software.