The design of modern decentralized power systems in telecommunication
applications are increasingly realized by using distributed dc/dc powe
r modules. Power modules are usually characterized by high switching f
requencies, which enable the use of small ferrite magnetics and cerami
c capacitors to enhance the reliability, the power density, and the po
ssibility of live insertion, all desired features in new power system
designs, However, to utilize the advantages of power modules there are
a number of considerations to be made in the design, These considerat
ions are addressed focusing on Telecom systems with an average power d
issipation of <10 W/board, in free convection, i.e., nonforced convect
ion, and <80 W/board, in forced convection cooled cabinets of commonly
used mechanical sizes and designs for telecommunication equipment.