Microcontact printing was used to generate patterned self-assembled mo
nolayers of alkanethiolates on the surfaces of evaporated films of cop
per. These patterned SAMs could be directly used as ultrathin resists
that protected the underlying copper from etching in aqueous solutions
of FeCl3/ HCl or FeCl3/NH4Cl. Arrays of junctions of Ag/Ag2O/Cu were
fabricated using a multistep procedure that combines metal evaporation
, microcontact printing, and selective etching.