Particulates suspended in plasma can be sized in situ using the scatte
ring ratio method, which involves measuring the ratio of the parallel
and perpendicular polarizations of light scattered at 90 degrees. This
method of plasma monitoring is of interest for controlling contaminat
ion of silicon wafers and other thin film products during plasma etchi
ng and deposition procedures. For parameters typical of plasma process
ing, we report Mie scattering computations to test the method's sensit
ivity to the optical design and to uncertainties in the particle param
eters. A +/-20% error in the size determination can result either from
an uncertainty of +/-1 either in the real or in the imaginary part of
the refractive index or from a particle shape that deviates significa
ntly from a sphere. A +/-5% error results from a 0.1 degrees error in
aligning the scattering angle. To measure particulate diameters as sma
ll as 0.05 mu m, the detector solid angle should be < 10(-5) Sr and th
e extinction ratio of the polarizer must be < 10(-4). A calculation of
the signal-to-noise ratio reveals that it is untenably weak for parti
cle diameters smaller than about 0.04 mu m. The scattering ratio metho
d is usually inapplicable for polydisperse particulates, but it will s
till work in many cases for many plasma applications, in which particl
es stratify in different layers according to their size.