MULTICHIP-MODULE TESTING IN A FOUNDRY ENVIRONMENT

Authors
Citation
T. Storey, MULTICHIP-MODULE TESTING IN A FOUNDRY ENVIRONMENT, Solid state technology, 1996, pp. 16-20
Citations number
4
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied","Physics, Condensed Matter
Journal title
ISSN journal
0038111X
Year of publication
1996
Supplement
S
Pages
16 - 20
Database
ISI
SICI code
0038-111X(1996):<16:MTIAFE>2.0.ZU;2-E
Abstract
In a multichip module (MCM) foundry, the sheer quantity of circuits re quires testing methods different from those used in testing cards and boards. This article describes advances in known good die (KGD), bound ary scan (IEEE Std 1149.1), and other approaches for efficient testing of complex MCMs.