CURRENT PULSE PLATING OF NICKEL-IRON ALLOYS ON ROTATING-DISK ELECTRODES

Nickel-iron alloys were electrodeposited using transient pulsed curren ts on rotating disk electrodes. It was found that the influence of mas s transfer on the nickel and iron deposition rates is through the chem ical equilibrium of the respective surface electroactive species of ni ckel and ferrous hydroxyl ions. The iron reduction rate increases with the introduction of boric acid, while the nickel deposition rate decr eases at larger applied pulsed currents. Further additions of surfacta nts and complexing agents such as saccharin and ethylene diamine decre ase both the nickel and iron deposition rates through a simple surface -blocking and solution-chelating process.