A THERMAL-ELECTRIC MODEL OF THE CURRENT AND HEAT-FLOW IN RESISTIVE RIBBON PRINTING TECHNOLOGY

A 3-D, transient, coupled thermal-electric model for a moving ribbon a nd receiver structure in a resistive ribbon printer has been developed , using the ANSYS finite element code. The model predicts the instanta neous current density, voltage, and transient temperature distribution s in the multilayer ribbon and receiver structure. Use of the model is illustrated in the study of the impact of a number of the key system parameters on dye temperature. The parameters include the effects of t he total and component ribbon resistance, the heat conduction to the e lectrodes, and the exposure of printhead substrate to the ribbon surfa ce.