The formation of high density, energy storage devices is achievable us
ing composite material systems. Alternate layering of carbon aerogel w
afers and Ni foils with microporous separators is a prospective compos
ite for capacitor applications. An inherent problem exists concerning
the formation of a physical bond between the Ni foil and the porous ca
rbon wafer. The bond process temperature must be less than 1050 degree
s C, at which point the aerogel begins to degrade. The advantage of a
low temperature eutectic in the Ni-Ti alloy system solves this problem
. Ti, a carbide former, is readily adherent as a sputter deposited thi
n film on the carbon wafer. A vacuum bonding process is then used to j
oin the Ni foil and Ti coating through eutectic phase formation. The p
arameters for successful bonding are examined along with structural ch
aracterization of the Ni foil-carbon aerogel wafer interface. A 950 de
grees C 30 min heat treatment under high vacuum is found to yield bond
failure in the aerogel wafer covering one-third the surface area.