F. Hong et Ga. Rozgonyi, INTERDIFFUSION, PHASE-TRANSFORMATION, AND EPITAXIAL COSI2 FORMATION IN MULTILAYER CO TI-SI(100) SYSTEM/, Journal of the Electrochemical Society, 141(12), 1994, pp. 3480-3488
Interdiffusion, phase transformation, and epitaxial CoSi2 formation in
a Co/Ti multilayer-Si(100) system have been investigated. Evaporated
and sputtered Co/Ti multilayers were deposited on RCA-cleaned and dilu
te I-IF-dipped Si(100) substrate. The multilayer system was then subse
quently heat-treated by a two-step annealing process. An initial Ti(O)
amorphous layer formed due to oxygen/carbon incorporation during the
deposition, or a TiSi, amorphous layer formed by solid-state amorphiza
tion reaction. These interfacial layers evolved into a Co-Ti(O)-Si amo
rphous alloy which functioned as a diffusion membrane which controlled
the phase formed during subsequent annealing. The Co-silicide phase s
equence was CoSi2 --> Co2Si --> CoSi, and finally CoSi2 from 550 degre
es C to higher temperature. Preferentially oriented (311) CoSi formed
as the dominant phase in the temperature range from 650 to 800 degrees
C. Epitaxial CoSi2 nucleated from the CoSi template layer and grew su
bstantially during the high temperature second annealing. The resultin
g epitaxial CoSi2 layer exhibited superior thermal stability and a res
istivity as low as 15 mu Omega-cm, even for nanoscale thicknesses. Int
erface impurity cleansing by Ti, uniform and slow Co supply through th
e interfacial amorphous membrane, and a positive effect of the capping
layers throughout the process promoted preferential (311) CoSi format
ion and subsequent epitaxial CoSi2 growth.