CHEMICAL BONDING AND INTERFACE ANALYSIS OF ULTRATHIN SILICON-NITRIDE LAYERS PRODUCED BY ION-IMPLANTATION AND ELECTRON-BEAM RAPID THERMAL ANNEALING (EB-RTA)
A. Markwitz et al., CHEMICAL BONDING AND INTERFACE ANALYSIS OF ULTRATHIN SILICON-NITRIDE LAYERS PRODUCED BY ION-IMPLANTATION AND ELECTRON-BEAM RAPID THERMAL ANNEALING (EB-RTA), Applied physics. A, Solids and surfaces, 59(4), 1994, pp. 435-439
N-15(2+) ions were implanted into c-Si with an energy of 5 keV/atom an
d fluences ranging from 5 x 10(16) to 2 x 10(17) atoms/cm2 at RT to fo
rm ultrathin silicon-nitride layers (SiN(x)) with different N/Si ratio
s depending on the fluences (up to an overstoichiometric N/Si ratio of
1.65). The N-15 depth distributions were analysed by the resonant nuc
lear reaction N-15 (p, alphagamma)C-12(E(res) = 429 keV). The implante
d samples were processed by Electron Beam Rapid Thermal Annealing (EB-
RTA) at 1150-degrees-C for 15 s (ramping up and down 5-degrees-C/s). T
he chemical structure of the N-15 implantation into Si was investigate
d by EXAFS and NEXAFS. Channeling-RBS (He-4+, E0 = 1.5 MeV) measuremen
ts were performed to observe the transition region (disordered-Si laye
r, d-Si) being underneath of the SiN(x) layer (typical values of layer
thicknesses: SiN(x) 24 nm, d-Si 6 nm).