The phase growth sequence, structural, electrical and optical properti
es and thermal stability of platinum silicide films were investigated
as a function of silicide film thickness in the range 133-2506 Angstro
m. The platinum silicide films were formed by ex situ silicidation of
Pt films sputter-deposited onto n(-)-Si (100) substrates. Films of all
thicknesses were polycrystalline brit exhibited columnar growth morph
ology and strong orientation effects. The orientation, grain size, ele
ctrical resistivity, specular reflectance and thermal stability were o
bserved to be strongly thickness dependent. The temperature at which t
he film properties degraded increased with film thickness. The degrada
tion mechanism appeared to be Pt diffusion into Si accompanied by the
disintegration of the PtSi layer and the formation of an additional Pt
3Si phase.