F. Corni et al., RECRYSTALLIZATION OF STRAINED GEXSI1-X SI LAYERS WITH VARIOUS GE GRADIENTS AND IN THE PRESENCE OF IMPURITIES, Materials science & engineering. B, Solid-state materials for advanced technology, 28(1-3), 1994, pp. 9-13
The recrystallization of amorphous GexSi1-x thin films on Si with unif
orm and with increasing Ge content is studied. The amorphous-crystal i
nterface roughness is modified by the presence of C and O impurities b
efore entering the GexSi1-x layer. The crystallization kinetics are he
avily affected by the resulting interface morphology. A minimum veloci
ty is found in the region of the impurities where the interface starts
to roughen; the strain effect induced by the Ge within the GexSi1-x i
s overcome and the crystallization proceeds according to kinetics very
similar to those for pure Si.