Intermixing the wells and barriers of quantum well structures generall
y results in an increase in the band gap and is accompanied by changes
in the refractive index. A range of techniques, based on impurity dif
fusion, dielectric capping and laser annealing, have been developed to
enhance the quantum well intermixing (QWI) rate in selected areas of
a wafer. Such processes offer the prospect of a powerful and relativel
y simple fabrication route for integrating optoelectronic devices and
for forming photonic integrated circuits (PICs). Recent progress in QW
I techniques is reviewed, concentrating on processes which are compati
ble with PIC applications, and illustrated with device demonstrators.