C. Persad et S. Raghunathan, POSTTEST CHARACTERIZATION OF THE HARDNESS AND MICROSTRUCTURE OF COPPER RAILS FROM A 9-MJ ELECTROMAGNETIC LAUNCHER, IEEE transactions on magnetics, 31(1), 1995, pp. 740-745
Following a test series consisting of sixty-seven experiments, the rai
ls from a 90 mm diameter x 10 m long launcher were removed for metallu
rgical characterization. The rails were machined from OFHC copper extr
usions. The measured Brinell hardness values of the rails ranged from
HB 60 to HB 86. The starting material had a hardness of HB 86. Observe
d values increased from the breech up to a distance of approximately 4
m and tended to decrease and level off beyond 4 m. These hardness val
ues are normal for worked OFHC copper, falling between those for fully
annealed (HB 34) and cold rolled (HB 91) conditions, The compressive
flow strength of the as-received material was determined to be sigma(f
) 331 epsilon(0.12) MPa. Extensive cratering and hypervelocity gouging
damage was observed except in the regions 1 m from the breech end and
between 7.5 and 10 m. The microstructure of the as-received rail mate
rial was fully dense and equiaxed and the average grain size was 100 m
u m. Sections were removed from the 2 m, 4 m, and 8 m locations for me
tallographic analysis. Average grain sizes at the 2, 4, and 8 m locati
ons were 45 mu m, 100 mu m, and 65 mu m, respectively. The larger grai
n size at the 4 m location was correlated with grain growth resulting
from the high heat flux associated with armature transitioning. Twinni
ng, a structural feature in shock-loaded copper, was observed at the 4
m and 8 m locations. X-ray dot mapping and energy dispersive spectros
copy analyses revealed that the colored patches close to the 4 m locat
ion were composed of a reaction product of copper (rail material) and
aluminum and zinc (armature-7075 aluminum alloy). An x-ray line profil
e analysis showed that aluminum had migrated to a depth of about 150 m
u m from the surface of the rail. One weight percent of aluminum disso
lved in copper halves its room-temperature con ductivity.