EFFECTS OF THE IMIDIZATION TEMPERATURE OF POLY(IMIDE-SILOXANE) ON THEADHESION STRENGTH OF EPOXY-RESIN POLY(IMIDE-SILOXANE) JOINTS

Authors
YUN HK CHO K AN JH PARK CE SIM SM PARK JM
Citation
Hk. Yun et al., EFFECTS OF THE IMIDIZATION TEMPERATURE OF POLY(IMIDE-SILOXANE) ON THEADHESION STRENGTH OF EPOXY-RESIN POLY(IMIDE-SILOXANE) JOINTS, Journal of adhesion science and technology, 8(12), 1994, pp. 1395-1411
Citations number
15
Categorie Soggetti
Engineering, Chemical","Material Science",Mechanics
Journal title
Journal of adhesion science and technology → ACNP
ISSN journal
01694243
Volume
8
Issue
12
Year of publication
1994
Pages
1395 - 1411
Database
ISI
SICI code
0169-4243(1994)8:12<1395:EOTITO>2.0.ZU;2-I
Abstract
The effects of the imidization temperature of poly(imide-siloxane) on the adhesion strength of epoxy resin/poly(imide-siloxane) joints were studied. The effects of the content and molecular weight of polydimeth ylsiloxane in poly(imide-siloxane) on the adhesion strength were also examined with samples of pyromellitic dianhydride-4,4'-oxydianiline (P MDA-ODA) containing various amounts and molecular weights of aminoprop yl-terminated polydimethylsiloxane (SDA). The adhesion strength increa sed with increasing imidization temperature in the air environment and was found to be sensitive to the content and molecular weight of SDA. The adhesion mechanism of epoxy resin/poly(imide-siloxane) joints was investigated using various analytical techniques. The failure mode of the joint was found to be cohesive in the poly(imide-siloxane) layer very close to the interface.