S. Onaka et al., RETARDATION OF INTERGRANULAR FRACTURE AT INTERMEDIATE TEMPERATURES BYA BOUNDARY NODE IN A CU-9 AT-PERCENT AL-ALLOY TRICRYSTAL, Acta metallurgica et materialia, 43(1), 1995, pp. 307-311
Citations number
13
Categorie Soggetti
Material Science","Metallurgy & Metallurigical Engineering
The effect of a boundary node on intergranular fracture at intermediat
e temperatures is discussed from creep tests employing a Cu-9 at. % Al
alloy tricrystal. In situ observation to measure the amount of grain-
boundary sliding is made during the creep tests. At temperatures betwe
en 773 and 923 K under an applied stress of 35 or 40 MPa, cracks to ca
use intergranular fracture appear in bicrystal and tricrystal specimen
s after the occurrence of a critical amount of grain-boundary sliding.
The boundary node lowers the rate of the grain-boundary sliding and t
hereby retards the intergranular fracture. This is different from the
effect of the boundary node at higher temperatures, where the boundary
node becomes a preferential site for crack formation.