KINETIC-STUDY OF LOW-TEMPERATURE TRANSIENT LIQUID-PHASE JOINING OF ANALUMINUM-SIC COMPOSITE

Authors
SABATHIER V EDWARDS GR CROSS CE
Citation
V. Sabathier et al., KINETIC-STUDY OF LOW-TEMPERATURE TRANSIENT LIQUID-PHASE JOINING OF ANALUMINUM-SIC COMPOSITE, Metallurgical and materials transactions. A, Physical metallurgy andmaterials science, 25(12), 1994, pp. 2705-2714
Citations number
37
Categorie Soggetti
Metallurgy & Metallurigical Engineering","Material Science
Journal title
Metallurgical and materials transactions. A, Physical metallurgy andmaterials science → ACNP
ISSN journal
10735623
Volume
25
Issue
12
Year of publication
1994
Pages
2705 - 2714
Database
ISI
SICI code
1073-5623(1994)25:12<2705:KOLTLJ>2.0.ZU;2-N
Abstract
The transient liquid phase (TLP) joining of an aluminum 6061-SiC compo site using a gallium interface has been investigated. The observed kin etics of this process suggest that diffusion occurs along interphase a nd subgrain boundaries at low temperatures (<723 K). An existing TLP m odel has been modified to account for this behavior.