LOW-ENERGY ELECTRON-BEAM-ENHANCED FORMATION OF ULTRATHIN INSULATING SILICON OXYNITRIDE LAYERS ON SI(100) AT MODERATE TEMPERATURES - IN-SITUDETERMINATION OF THE BAND-GAP ENERGY USING ELECTRON-ENERGY-LOSS SPECTROSCOPY
P. Poveda et A. Glachant, LOW-ENERGY ELECTRON-BEAM-ENHANCED FORMATION OF ULTRATHIN INSULATING SILICON OXYNITRIDE LAYERS ON SI(100) AT MODERATE TEMPERATURES - IN-SITUDETERMINATION OF THE BAND-GAP ENERGY USING ELECTRON-ENERGY-LOSS SPECTROSCOPY, Surface science, 323(3), 1995, pp. 258-268
Exposure of a Si(100)-2 X 1 surface to low pure NO gas pressures (less
than or equal to 8 X 10(-6) mbar) at moderate temperatures (room temp
erature (RT) - 600 degrees C) leads to the formation of an amorphous p
assivating oxynitride layer (thickness similar to 0.5 nm). However, we
show that low energy (100 eV) electron bombardment of the surface, du
ring exposure to NO, induces the formation of amorphous ultrathin (les
s than or equal to 2 nm) silicon oxynitride films having different ele
mental compositions. At RT, oxygen-rich films were grown, while nitrog
en-rich layers were formed at 600 degrees C. This result confirms rece
nt published data where synchrotron radiation (thermal activation) at
RT (above 1000 degrees C) was found to be an efficient promoter of the
oxidation (nitridation) of silicon using low pure NO gas pressures. T
he thickness and the composition parameter 0/(0 + N) of the resulting
insulating layers have been deduced from Anger electron spectroscopy (
AES) measurements. The band gaps of various ultrathin films already fo
rmed have been determined in situ using reflection electron energy los
s spectroscopy (EELS). For this purpose, the true N(E) distributions o
f inelastically-backscattered electrons have been deduced, using a num
erical procedure, from EELS spectra recorded by means of a standard si
ngle-pass cylindrical mirror analyzer operated in the pulse counting m
ode.