ELECTRODEPOSITION OF METALS INTO POROUS SILICON

Authors
JESKE M SCHULTZE JW THONISSEN M MUNDER H
Citation
M. Jeske et al., ELECTRODEPOSITION OF METALS INTO POROUS SILICON, Thin solid films, 255(1-2), 1995, pp. 63-66
Citations number
8
Categorie Soggetti
Physics, Applied","Material Science","Physics, Condensed Matter
Journal title
Thin solid films → ACNP
ISSN journal
00406090
Volume
255
Issue
1-2
Year of publication
1995
Pages
63 - 66
Database
ISI
SICI code
0040-6090(1995)255:1-2<63:EOMIPS>2.0.ZU;2-4
Abstract
The electroless and cathodic electrodeposition of metals (Au, Cu, Ni) into porous silicon (PS) is studied. The electrochemically modified PS layers are analysed by X-ray photoelectron spectroscopy and sputter d epth profiling. The electroless deposition oxidizes PS simultaneously. For this reaction a new concept of injection current multiplication i s proposed. After cathodic metal deposition the pores are filled with metal quantitatively without oxidation of PS.