INVESTIGATION OF CURE IN EPOXY ACRYLATE RESINS USING RHEOLOGICAL AND DIELECTRIC MEASUREMENTS

Citation
S. Radhakrishnan et al., INVESTIGATION OF CURE IN EPOXY ACRYLATE RESINS USING RHEOLOGICAL AND DIELECTRIC MEASUREMENTS, Polymer engineering and science, 35(2), 1995, pp. 184-189
Citations number
32
Categorie Soggetti
Polymer Sciences","Engineering, Chemical
ISSN journal
00323888
Volume
35
Issue
2
Year of publication
1995
Pages
184 - 189
Database
ISI
SICI code
0032-3888(1995)35:2<184:IOCIEA>2.0.ZU;2-6
Abstract
Dielectric and theological measurements are reported for the cure in a series of mixtures of an epoxy-acrylate with n-butyl methacrylate. Th e level of the initiator and proportions of the epoxy acrylate and n-b utyl methacrylate influence the cure characteristics and morphology of the film formed. Analysis of the theological data indicates that duri ng the curing process, microphase separation occurs within the mixture . The changes in the dielectric relaxation behavior with composition o f the completely cured material is also consistent with microphase sep aration occurring in these resins while they are cured.