S. Radhakrishnan et al., INVESTIGATION OF CURE IN EPOXY ACRYLATE RESINS USING RHEOLOGICAL AND DIELECTRIC MEASUREMENTS, Polymer engineering and science, 35(2), 1995, pp. 184-189
Dielectric and theological measurements are reported for the cure in a
series of mixtures of an epoxy-acrylate with n-butyl methacrylate. Th
e level of the initiator and proportions of the epoxy acrylate and n-b
utyl methacrylate influence the cure characteristics and morphology of
the film formed. Analysis of the theological data indicates that duri
ng the curing process, microphase separation occurs within the mixture
. The changes in the dielectric relaxation behavior with composition o
f the completely cured material is also consistent with microphase sep
aration occurring in these resins while they are cured.