Cr. Kingsley et al., DEVELOPMENT OF CHEMICAL BEAM EPITAXY FOR THE DEPOSITION OF GALLIUM NITRIDE, Materials science & engineering. B, Solid-state materials for advanced technology, 29(1-3), 1995, pp. 78-82
Modern approaches to the growth of high quality gallium nitride thin f
ilms have focused on the use of metal-organic vapour phase epitaxy or
plasma-assisted gas source molecular beam epitaxy. However, both of th
ese techniques possess limitations. The present study therefore examin
ed a new approach to GaN deposition using chemical beam epitaxy and th
e new nitrogen precursor, hydrogen azide. Thin films of gallium nitrid
e (GaN) were successfully prepared. X-ray photoelectron spectroscopy r
eveals that stoichiometric material is formed with little or no contam
ination when HN3 and a range of Ga precursors react on the substrate a
t temperatures down to 450 degrees C. The results indicate that the in
corporation efficiency of N in the GaN film from HN3 is high, suggesti
ng the precursor may provide a more attractive route to the deposition
of GaN films under low pressure molecular beam conditions than is cur
rently offered using ammonia or plasma-excited nitrogen beam sources.
Electrical measurements on the grown films are also reported.