DEVELOPMENT OF CHEMICAL BEAM EPITAXY FOR THE DEPOSITION OF GALLIUM NITRIDE

Citation
Cr. Kingsley et al., DEVELOPMENT OF CHEMICAL BEAM EPITAXY FOR THE DEPOSITION OF GALLIUM NITRIDE, Materials science & engineering. B, Solid-state materials for advanced technology, 29(1-3), 1995, pp. 78-82
Citations number
22
Categorie Soggetti
Material Science","Physics, Condensed Matter
ISSN journal
09215107
Volume
29
Issue
1-3
Year of publication
1995
Pages
78 - 82
Database
ISI
SICI code
0921-5107(1995)29:1-3<78:DOCBEF>2.0.ZU;2-C
Abstract
Modern approaches to the growth of high quality gallium nitride thin f ilms have focused on the use of metal-organic vapour phase epitaxy or plasma-assisted gas source molecular beam epitaxy. However, both of th ese techniques possess limitations. The present study therefore examin ed a new approach to GaN deposition using chemical beam epitaxy and th e new nitrogen precursor, hydrogen azide. Thin films of gallium nitrid e (GaN) were successfully prepared. X-ray photoelectron spectroscopy r eveals that stoichiometric material is formed with little or no contam ination when HN3 and a range of Ga precursors react on the substrate a t temperatures down to 450 degrees C. The results indicate that the in corporation efficiency of N in the GaN film from HN3 is high, suggesti ng the precursor may provide a more attractive route to the deposition of GaN films under low pressure molecular beam conditions than is cur rently offered using ammonia or plasma-excited nitrogen beam sources. Electrical measurements on the grown films are also reported.