OPTOELECTRONIC PACKAGING USING SILICON SURFACE-MICROMACHINED ALIGNMENT MIRRORS

We describe a batch-assembled optoelectronic packaging technology base d on silicon surface-micromachined alignment mirrors and demonstrate t hat these mechanical structures have the functionality, stability and accuracy required for active semiconductor laser-to-fiber (single mode ) coupling. In initial experiments, we measure an open-loop position a ccuracy of 0.2 mu m, and we achieve repeatable 45% coupling efficiency with good mechanical stability.