Es. Park et al., MICROSTRUCTURE AND REACTIONS OF SICW-REINFORCED ALUMINA WITH AG-CU-IN-TI, Journal of the American Ceramic Society, 78(1), 1995, pp. 15-20
Brazing experiments mere performed at 750 degrees C for 2 h between Ag
-Cu-In-Ti alloy and SICw/Al2O3. The first clearly nonbraze layer consi
sts of an oxide layer of metallic composition 33Ti-31Al-22Cu-14Si. Are
as adjacent to the SIC whiskers were of different composition. A thin,
continuous layer on the alumina portion of the composite appears to b
e gamma-TiO. The SIC whiskers are preferentially consumed and undergo
reductions in diameter of approximately 40%. Observed ''knobby'' whisk
er morphologies may be related to SiC stacking faults. eta-type phases
detected near the Ag-Cu eutectic portion of the joint appear to consi
st of Ti-Cu-AL-Si-O and Ti3Cu3O.