MICROSTRUCTURE AND REACTIONS OF SICW-REINFORCED ALUMINA WITH AG-CU-IN-TI

Citation
Es. Park et al., MICROSTRUCTURE AND REACTIONS OF SICW-REINFORCED ALUMINA WITH AG-CU-IN-TI, Journal of the American Ceramic Society, 78(1), 1995, pp. 15-20
Citations number
30
Categorie Soggetti
Material Science, Ceramics
ISSN journal
00027820
Volume
78
Issue
1
Year of publication
1995
Pages
15 - 20
Database
ISI
SICI code
0002-7820(1995)78:1<15:MAROSA>2.0.ZU;2-T
Abstract
Brazing experiments mere performed at 750 degrees C for 2 h between Ag -Cu-In-Ti alloy and SICw/Al2O3. The first clearly nonbraze layer consi sts of an oxide layer of metallic composition 33Ti-31Al-22Cu-14Si. Are as adjacent to the SIC whiskers were of different composition. A thin, continuous layer on the alumina portion of the composite appears to b e gamma-TiO. The SIC whiskers are preferentially consumed and undergo reductions in diameter of approximately 40%. Observed ''knobby'' whisk er morphologies may be related to SiC stacking faults. eta-type phases detected near the Ag-Cu eutectic portion of the joint appear to consi st of Ti-Cu-AL-Si-O and Ti3Cu3O.