Ss. Shang et al., MICROSTRUCTURALLY-BASED ANALYSIS AND COMPUTATIONAL MODELING OF SHOCK CONSOLIDATION, Journal de physique. IV, 4(C8), 1994, pp. 521-526
The most important microstructural processes involved in shock consoli
dation are identified and illustrated for a nickel-based superalloy an
d silicon carbide. Interparticle melting, vorticity, voids, and partic
le fracture are observed. Various energy dissipation processes are ide
ntified and analyzed: plastic deformation, interparticle friction, mic
rokinetic energy, defect generation. An analytical expression is propo
sed for the energy requirement to shock consolidate a powder as a func
tion of strength, size, porosity, and temperature, based on a prescrib
ed interparticle melting layer. These analytical results are compared
to numerical solutions obtained by modeling the compaction of a discre
te set of particles with an Eulerian finite element program. Based on
the Analysis and computations, the inherent limitations of shock conso
lidation are identified and discussed.