THIN MULTILAYER PALLADIUM COATINGS FOR SEMICONDUCTOR PACKAGING APPLICATIONS .1. SOLDERABILITY

Authors
KADIJA IV ABYS JA MAISANO JJ KUDRAK EJ SHIMADA S
Citation
Iv. Kadija et al., THIN MULTILAYER PALLADIUM COATINGS FOR SEMICONDUCTOR PACKAGING APPLICATIONS .1. SOLDERABILITY, Plating and surface finishing, 82(2), 1995, pp. 56-62
Citations number
18
Categorie Soggetti
Metallurgy & Metallurigical Engineering","Materials Science, Coatings & Films
Journal title
Plating and surface finishing → ACNP
ISSN journal
03603164
Volume
82
Issue
2
Year of publication
1995
Pages
56 - 62
Database
ISI
SICI code
0360-3164(1995)82:2<56:TMPCFS>2.0.ZU;2-B
Abstract
A study of the physical and chemical characteristics of electroplated palladium has led to an understanding of its performance as a solderab le and wirebondable material. Investigation of the interactions of por osity, interdiffusion, oxidation and dissolution rates of various meta ls in Sn-Pb solder has led to the design of various multilayered palla dium coatings useful for advanced electronic packaging applications. C ombinations of palladium and palladium alloys with a thin gold flash e xhibit good solderability and wirebonding performance and meet the str ingent requirements of MIL-STD-883, Methods 2003 and 2022.