Ma. Mendicino et Eg. Seebauer, KINETICS OF SALICIDE CONTACT FORMATION FOR THIN-FILM SOI TRANSISTORS, Journal of the Electrochemical Society, 142(2), 1995, pp. 28-30
Problems of voiding and poor contact resistance have plagued recent at
tempts to apply salicide technology to silicon-on-insulator (SOI) tran
sistors. A physical picture is developed to explain why these problems
occur. The picture rests on the known kinetics of silicide formation
and the resistance to silicon diffusion imposed by device geometry.