Mk. Weldon et al., INFRARED-SPECTROSCOPY AS A PROBE OF FUNDAMENTAL PROCESSES IN MICROELECTRONICS - SILICON-WAFER CLEANING AND BONDING, Surface science, 368, 1996, pp. 163-178
In this paper, we review our recent infrared studies of the fundamenta
l physical and chemical processes occurring al the interface of bonded
silicon wafers, as a function of surface preparation and annealing te
mperature. We present a brief overview of the practical aspects of sil
icon-wafer bonding and the techniques used to evaluate the interface i
ntegrity, which highlight the need for fundamental studies of the micr
oscopic interface phenomena. Importantly, we show that the interface b
etween two silicon wafers approximates an ideal spectroscopic environm
ent, in that there is a 28-fold enhancement in the sensitivity to the
normal component of the interface absorption over any other surface op
tical geometry. Furthermore, the interface region is almost infinitely
stable at room temperature, but can exhibit partial pressures ranging
from near vacuum to several atmospheres upon annealing. We present re
sults for two distinct types of wafer bonding: hydrophobic (hydrogen-t
erminated and hydrophilic (oxide-terminated), since the origin of the
initial attraction between the opposing surfaces is quite different in
the two cases. Specifically, we show that ideally hydrogen-terminated
Si(111) surfaces come within a few Angstrom, under the influence of a
Van der Waals attraction, as evidenced by a pronounced perturbation o
f the isolated Si-H stretch mode. In contrast, the initial attraction
between hydrophilic surfaces is via hydrogen bonding, which is mediate
d by the presence of 2-4 monolayers of water that are trapped at the i
nterface upon room-temperature joining. We demonstrate that vibrationa
l spectroscopy provides unprecedented mechanistic insight into the the
rmal evolution of the molecular interface, which necessarily has a pro
found influence on the bonding process. Throughout the paper, emphasis
is given to the need for a wide variety of additional (fundamental) s
tudies of the surface phenomena occurring in these novel, technologica
lly important systems.