Ae. Martinelli et Ral. Drew, MICROSTRUCTURAL DEVELOPMENT DURING DIFFUSION BONDING OF ALPHA-SILICONCARBIDE TO MOLYBDENUM, Materials science & engineering. A, Structural materials: properties, microstructure and processing, 191(1-2), 1995, pp. 239-247
Silicon carbide was joined to molybdenum by solid state bonding at tem
peratures ranging from 1200 degrees C to 1700 degrees C. The interface
s were characterized by scanning electron microscopy, electron probe m
icroanalysis, and X-ray diffraction. Diffusion of Si and C into Mo res
ulted in a reaction layer with two main phases: Mo5Si3 and Mo2C. For t
emperatures higher than 1400 degrees C a ternary phase of composition
Mo5Si3C was also formed, and at 1700 degrees C nucleation of MoC was o
bserved.